TSM 台積電 · TSMC
別名
- 繁中
- 台積電 / 台積 / 台灣積體電路
- English
- TSMC
近 30 日相關文章(30)
- SpaceX and Anthropic, xAI's Two Companies, Elon Musk and SpaceXAI's Future
- Microsoft Earnings, Apple Earnings
- Intel Earnings, Intel's Differentiation?, Whither Terafab
- An Interview with Google Cloud CEO Thomas Kurian About the Agentic Moment
- Nvidia Earnings, The AI Stack, Nvidia’s New Reporting
- An Interview with Ben Thompson at the MoffettNathanson Media, Internet & Communications Conference
- The Deployment Company, Back to the 70s, Apple and Intel
- Taiwan overtakes India as world's fifth-largest stock market as TSMC surges
- An Interview with Ben Thompson at the MoffettNathanson Media, Internet & Communications Conference
- The Deployment Company, Back to the 70s, Apple and Intel
- SpaceX and Anthropic, xAI's Two Companies, Elon Musk and SpaceXAI's Future
- Microsoft Earnings, Apple Earnings
- Intel Earnings, Intel's Differentiation?, Whither Terafab
- An Interview with Google Cloud CEO Thomas Kurian About the Agentic Moment
- TSMC Earnings, New N3 Fabs, The Nvidia Ramp
- TSMC Earnings, New N3 Fabs, The Nvidia Ramp
- An Interview with Google Cloud CEO Thomas Kurian About the Agentic Moment
- Microsoft Earnings, Apple Earnings
- Intel Earnings, Intel's Differentiation?, Whither Terafab
- An Interview with Ben Thompson at the MoffettNathanson Media, Internet & Communications Conference
- The Deployment Company, Back to the 70s, Apple and Intel
- SpaceX and Anthropic, xAI's Two Companies, Elon Musk and SpaceXAI's Future
- TSMC Earnings, New N3 Fabs, The Nvidia Ramp
- An Interview with Ben Thompson at the MoffettNathanson Media, Internet & Communications Conference
- The Deployment Company, Back to the 70s, Apple and Intel
- SpaceX and Anthropic, xAI's Two Companies, Elon Musk and SpaceXAI's Future
- Microsoft Earnings, Apple Earnings
- Intel Earnings, Intel's Differentiation?, Whither Terafab
- An Interview with Google Cloud CEO Thomas Kurian About the Agentic Moment
- An Interview with Google Cloud CEO Thomas Kurian About the Agentic Moment
歷次 thesis 中的出現
- 2026-05-25
- 多2026 Capex 上限 $56B 確認,AI 需求極度強勁,先進製程供給緊缺假說獲財報直接支持。
- 2026-05-24
- 多TSMC 2026 Capex 趨向 $56B 上限,N3/N2 需求由 GOOGL TPU + NVDA Rubin + AAPL M 系列三路確認,供給緊張假說持續有效。
- 2026-05-23
- 多TSMC 2026 Capex上修至$56B上限,CC Wei升級agentic AI需求定性,前端製程需求週期延伸至2027-2028年確認
- 2026-05-22
- 多2026 年收入成長上修至 30%+,N2/N3 產能需求可見度延至 2027,ai-energy 電力瓶頸強化先進製程稀缺性論點
- 2026-05-21
- 多TSMC 2026年Capex$56B上緣+營收成長逾30%,agentic需求驅動N2/N3長期產能吃緊,h-001 capacity-tight假說重獲基本面錨點
- 2026-05-19
- 多TSMC 上修 2026 年營收增速至 30%+、Capex 趨向 56B 上限,代理人運算需求確認多年擴產週期
- 2026-05-18
- 多TSMC 管理層確認 agentic 需求跳升、Capex 趨上緣,供給瓶頸假說強化,長期代工壟斷地位無替代
- 2026-05-16
- 多TSMC上調Capex至$56B上緣+agentic AI推動token消耗新台階,先進製程稀缺性護城河在2026年被多路客戶需求強化
- 2026-05-15
- 多TSMC法說確認>30%全年成長+N3擴廠,agentic token需求驅動多年資本支出上修,chip layer多頭假說獲最強財務佐證
- 2026-05-14
- 多NVDA Rubin+Anthropic TPU+Apple A系列三方需求收斂於N2/N3,2026 Capex高端$56B執行確認,前沿算力需求假說最直接受益標的
- 2026-05-13
- 多TSMC 上修 2026 收入增長 >30% 且 capex 趨向 $56B 上限,供給硬度確認,ai-energy-power-infrastructure-bottleneck 外的唯一先進製程入口。
- 2026-05-12
- 多2026 Capex 趨向 $56B 上限,agentic token 消費台階式提升確認多年 leading-edge 需求,對應 ai-energy-power-infrastructure-bottleneck h-001
- 2026-05-11
- 多2026 全年成長上調至逾 30%、capex 趨 $56B 上緣,agentic AI token 需求驅動 N3/N2 滿載,foundry 層需求硬撐
- 2026-05-10
- 多2026 Capex上移至$56B上緣,agentic AI驅動leading-edge silicon多年需求,對應TSMC Risk假說修正為conviction轉向
- 2026-05-09
- 觀察Anthropic 3.5GW TPU+Rubin量產同步搶N2/N3產能,需確認2026 capex高端執行進度才能判斷供給瓶頸時點
- 2026-05-08
- 多2026 全年成長指引上修至 >30%,capex 移往 $56B 上限,AI 推理需求為多年期結構支撐
- 2026-04-30
- 多Arm 新增 fabless 需求 + Anthropic 算力爆炸 + NVDA Rubin 三重疊加,N2/N3 產能供不應求結構持續至 2027
- 2026-04-29
- 多2026 capex趨向$56B上限,agentic AI推動N3/N2需求超預期,多客戶競搶產能確認超級週期,對應ai-energy-power-infrastructure-bottleneck晶片需求確認
- 2026-04-28
- 多2026全年營收指引上調>30%,N3 Capex趨$56B上限,agentic AI驅動多年先進製程需求剛性
- 2026-04-27
- 多Anthropic 3.5GW TPU + Arm AGI CPU + NVDA Rubin 三路需求鎖定 N2/N3 產能,TSMC 上調指引至 30%+ 成長已確認,供給稀缺使定價權持續
- 2026-04-26
- 多TSMC 2026 Capex 向 560 億上限靠攏,Arm 新入局強化先進製程需求密度,ai-energy-power-infrastructure-bottleneck 瓶頸前移至晶圓端
- 2026-04-25
- 多Arm fabless 進場+NVDA Rubin+Anthropic TPU 需求三重拉動 N2/N3 產能,TSMC Capex 上緣確認定價能力,對應 ai-energy-power-infrastructure-bottleneck h-002 供給橋接受益
- 2026-04-24
- 多Capex上修至56B上限、N3/N2產能為Arm/NVDA/AAPL必爭,對應ai-energy-power-infrastructure-bottleneck電力瓶頸延後窗口假說。
- 2026-04-16
- 多GW級資料中心建設潮+Arm AGI CPU+NVDA Rubin同步拉升N2/N3先進製程訂單能見度
知識庫
KB 快照整合仍由每日 briefing 的 CompanyContextDrawer 提供。獨立頁的 KB 拉取會在 v0.3.1 接入。